Arbitrary Modeling of Tsvs for 3D Integrated Circuits (Analog Circuits and Signal Processing) (Paperback)

Arbitrary Modeling of Tsvs for 3D Integrated Circuits (Analog Circuits and Signal Processing) By Khaled Salah, Yehea Ismail, Alaa El-Rouby Cover Image

Arbitrary Modeling of Tsvs for 3D Integrated Circuits (Analog Circuits and Signal Processing) (Paperback)

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Product Details ISBN: 9783319374970
ISBN-10: 3319374974
Publisher: Springer
Publication Date: August 23rd, 2016
Pages: 179
Language: English
Series: Analog Circuits and Signal Processing